3D integration technologies based on highly integrated substrates and bare chips solve the problem of miniaturization of complex functional devices. However, increasing complexity and decreasing mass-size parameters of products lead to problems of effective heat distribution and dissipation from frameless microcircuits. The article considers features and problems of thermal analysis of 3D computing microsystem based on several modules with bare-metal chips, and also shows the importance of modeling the actual heat generation of programmable logic integrated circuits.

Keywords: microassembly, microsystem, chipless chip, FPGA, thermal analysis, CAD, finite element method, heat transfer simulation, printed circuit board, three-dimensional integration